One of the key benefits of the ribbed wafer head is its ability to improve heat transfer efficiency. Traditional flat wafer heads can suffer from hot spots and uneven heating, which can lead to defects and reduced yields. The ribbed structure helps to distribute heat more evenly across the wafer, ensuring that all areas receive the necessary thermal energy for optimal processing. This results in improved device performance and reliability, as well as reduced cycle times and costs.
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2025-08-14 23:05
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